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Diamond Tools Product List

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Diamond tool

Wide compatibility with ultrasonic processing machines as well as general processing machines!

We handle a wide range of diamond tools manufactured by SCHOTT. SCHOTT's diamond tools reduce processing load with thin-walled tools, achieving shorter processing times. We offer metal bond and electroplated diamond tools tailored to various processing applications. 【Features】 ■ Core drills can be produced with an outer diameter of Φ0.3 mm and an inner diameter of 0.1 mm. ■ High aspect ratio processing is possible using hollow-type tools with a center-through method. ■ Small-diameter core drills can be produced in electroplated type, resulting in longer tool life than electroplated tools. ■ Processing times are shortened as we manufacture with consideration of the processing content. ■ We can propose processing conditions tailored to the workpiece material. *For more details, please download the PDF or feel free to contact us.

  • Diamond cutter
  • Other cutting tools
  • Work tools
  • Diamond Tools

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What are wrapping, polishing, and grinding? Explanation of technical terms.

Explanation of specialized terms in grinding and polishing.

・Introduction When involved in the processing and surface treatment of high-precision parts in manufacturing environments, you may come across English expressions related to grinding and polishing. Lapping, polishing, and grinding are all processes that involve removing material to achieve a finish, and they are often treated as having similar meanings. However, there are significant differences in the principles of processing, objectives, the state of the abrasive particles used, and the precision achieved. In this article, we will clarify the etymological background and technical meanings of these terms and provide an easy-to-understand introduction to the differences between each processing method. Etymology and Technical Meaning of "Lap" and "Lapping" "Lap" is a word in English that means "to cover" or "to envelop." It also includes the concept of "layers," such as in "lap time," which is used in track and field to refer to "laps" or "overlaps." In polishing processes, lapping utilizes the fine abrasive particles that exist between the lap plate and the workpiece to gradually remove material from the surface. For more information, please search for "Grinding and Polishing Dot Com"!

  • Wafer processing/polishing equipment
  • Diamond Tools

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